HPS Neural-Chip NPU
Automated inference processor core.
Nexus EDA Engine
Cloud-based logic synthesis and routing.
HPS Thermal-Sim
Advanced heat dissipation modeling.
Global IP Portal
Database of over 500,000 verified blocks.
HPSporTech provides elite semiconductor EDA tools, foundry-ready IP, and thermal biometrics. Equip your R&D with cutting-edge tools to dominate the fabrication node.
End-to-end yield analysis, lithography recruitment scouting, and wafer load monitoring for professional tier organizations.
View Pro Details >Streamline tape-out review, track engineering progression, and collaborate across entire silicon design departments seamlessly.
View College Details >Our flagship automated 3nm tracking processor requires minimal power and delivers instant inference replay.
View Hardware >Cloud-based algorithmic layouts that automatically tag netlists, map thermal heatmaps, and predict timing failures.
View Software >
HPSporTech Nexus
Sensors, 3D IC Packaging, and Machine Learning synchronized into one dashboard.
Discover Nexus FrameworkWe integrate direct thermal feedback loops. Sync thermal sensors, power envelopes, and leakage trackers directly with tape-out simulation.
When you align physical output metrics with logic synthesis, the context behind every gate, route, and clock becomes crystal clear.
From grassroots startups to world-class foundries.
Join over 5,000 elite organizations leveraging HPSporTech EDA algorithms.
May 2026
April 2026
March 2026
February 2026
Industry-leading IPs and intelligent EDA solutions.
Automated inference processor core.
Cloud-based logic synthesis and routing.
Advanced heat dissipation modeling.
Database of over 500,000 verified blocks.
Tailored enterprise architecture for massive semiconductor fabrication.
HPSporTech provides custom API integrations, dedicated cloud nodes, and white-labeled applications for major foundries. Let our engineers build your backend.
Guides, documentation, and 24/7 technical assistance.
Our global support team is available 24/7 to assist with critical design issues.